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BIND 2024 Innovation and Acceleration Program

BIND 2024 Innovation and Acceleration Program

The BIND Open Innovation and Acceleration Program connects dynamic startup teams with well-established companies, to provide external solutions for their internal digital transformation challenges while promoting the development of commercial skills and encouraging the immersion of startups in the local ecosystem, catalyzing new business opportunities.

This zero-equity approach to investing and active acceleration allows startups to maintain ownership and get reference customers while earning paid contracts for implementing solutions in real environments.


BIND Innovation and Acceleration Program

Application DeadlineSeptember 6, 2024
Funding TypePartially Funded
TypeEntrepreneurs
SponsorBIND
GenderMen and Women
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Benefits of BIND Innovation and Acceleration Program

  • POC, Market Validation

  • Access to 70 Corporate Clients

  • Startup Acceleration

  • 43K Average Contract

  • Introductions to Industry Investors

  • High Impact Mentoring

  • Cross-Vertical Network Immersion

  • Retain Ownership, No Equity Taken

  • Key Business Workshops

Requirements for BIND Innovation and Acceleration Program

The disruptive technologies of interest expand each year to meet the needs of the 70+ Corporate Clients from the sectors of Intelligent Industry, Clean Energy & Sustainability, Health Tech and Food Tech in the Basque region. If you have developed any related solutions, we encourage you to apply to put your innovation into action.

  • Connectivity and IoT: Smart sensors, Geolocation & Traceability…

  • Artificial Intelligence: Artificial Vision, Machine Learning, Adaptative AI, NLP, IDPs…

  • Immersive Technologies: Augmented Reality, Mixed Reality, Virtual Reality, Digital Twin

  • Big Data: Advanced Analytics, Advanced Graphics Representation…

  • Software: Content Management Platforms, Document Management Systems…

  • Computing: Edge and Quantum Computing, Cloud Solutions, Virtual and Physical Servers…

  • Additive Manufacturing: Metallic, Plastic and Food Additive Manufacturing.

  • Cybersecurity: Digital Immune Systems, Securitization of Industrial assets…

  • Robotics and Electronics: Collaborative Robotics, Exoskeletons, Power electronics, Nanotechnology…

  • Sustainability & Circular economy: Recycling, Smart Grids and Cleantech.

  • Hydrogen Technologies

  • Health Tech: Medical devices, Biobased solutions…

  • Food Tech

Application Deadline

September 6, 2024

How to Apply

Interested and qualified? Go to BIND on bindplatform.com to apply

For more details,visit BIND website


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Be among the first to know whenever new BIND scholarship is going on. Enter your email address and click the Subscribe button ↓
Like our website? Follow us on Facebook