2025 Bond University Undergraduate Excellence Scholarship for International Students

Published: 25 Apr 2025

Bond International Undergraduate Excellence Scholarships provide tuition remission scholarships to high academic achievers, applying to study a bachelor's degree.

International Undergraduate Excellence Scholarships are awarded on the basis of academic merit, and are a testament to Bond University’s commitment to quality and outstanding international students.

Bond Uiversity Undergraduate Scholarship

Application Deadline	Not Specified
Funding Type	Partially Funded
Country to study	Australia
School to study	Bond University
Type	Undergraduate
Sponsor	Bond University

Bond Uiversity Undergraduate Scholarship Benefits

As an International Undergraduate Excellence Scholar, you will be awarded with 50% tuition remission for any single or approved combined undergraduate degree (excluding the Bond Medical Program), and will commence your studies in either the January, May or September semester.

Requirements for Bond Uiversity Undergraduate Scholarship

• Be an international student (i.e. not an Australian citizen, New Zealand citizen or permanent resident) living outside of Australia. 
• Have achieved, or are on track to achieve (conditional upon successful completion) academic excellence in the top percentile from your high school qualification equivalent to ATAR 95.00 or IB Diploma score of 38 or higher.
• Not have already commenced undergraduate studies at Bond University. Those studying English at Bond University College as part of a packaged offer are eligible to apply.
• Meet the standard entry requirements for your chosen program of study.
•  Not be completing, or have completed Australian year 12 in Australia. 
  Note: If you are currently studying high school in Australia you may be eligible to apply for an Australian Bond Excellence or Leadership Scholarship. 

Check also:
Queen Elizabeth Scholarship (How to Apply)

Application Deadline

Not Specified

How to Apply

Interested and qualified? Go to Bond University on student-bond.studylink.com to apply

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